Monolithic Integration of Enhancement- and Depletion-mode AlGaN/GaN HFETs

ABSTRACT

A method for and devices utilizing monolithic integration of enhancement-mode and depletion-mode AlGaN/GaN heterojunction field-effect transistors (HFETs) is disclosed. Source and drain ohmic contacts of HFETs are first defined. Gate electrodes of the depletion-mode HFETs are then defined. Gate electrodes of the enhancement-mode HFETs are then defined using fluoride-based plasma treatment and high temperature post-gate annealing of the sample. Device isolation is achieved by either mesa etching or fluoride-based plasma treatment. This method provides a complete planar process for GaN-based integrated circuits favored in high-density and high-speed applications.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from U.S. Provisional Patent Application 60/740,256 filed on Nov. 29, 2005, and also from U.S. Provisional Patent Application 60/748,339 filed on Dec. 8, 2005, both of which are hereby incorporated by reference.

BACKGROUND AND SUMMARY OF THE INVENTION

The present application relates to a method for monolithic integration of enhancement and depletion-mode heterojunction field effect transistors (“HFETs”) , and in particular, to fabrication of aluminum-gallium nitride/gallium nitride (“AlGaN/GaN”) HFETs using such monolithic integration.

Group III-nitride (“III-N”) compound semiconductors, such as those incorporating AlGaN/GaN, possess the advantages of having wide bandgap, high breakdown field, and large thermal conductivity, which can bring significant benefits to the design of heterostructure field-effect transistors and applications utilizing HFETs. Because of their high power handling capabilities, AlGaN/GaN HFETs can be used for radio frequency/microwave power amplifiers and high power switches. However, most power amplifiers and switches using AlGaN/GaN HFETs feature depletion-mode (“D-mode”) HFETs as the building block. Since a D-mode HFET is a transistor with a negative value for the threshold voltage (V_(th)), D-mode HFETs need both a positive and negative voltage bias to be turned on and off. If an enhancement-mode (“E-mode”) HFET could be made available, only a positive voltage supply would be needed for circuit applications, resulting in simplified circuits and reduced costs.

Furthermore, owing to the wide bandgap of the GaN-based semiconductor materials, AlGaN/GaN HFETs are capable of high-temperature operation (potentially up to 600° C.), and are thus suitable for high-temperature integrated circuits such as required in aviation and automotive applications. Further, for HFET-based logic circuits, the direct-coupled field effect transistor logic (“DCFL”) features the simplest configuration. In DCFLs, E-mode HFETs are used as drivers while D-mode HFETs are used as the load.

Note that at zero gate bias, a D-mode HFET is capable of conducting current, and is called “normally-on” whereas for an E-mode HFET, the transistor is not conducting current , and is called “normally-off”.

FIG. 1 shows an E-mode HFET 10 using a thin AlGaN barrier layer 12, an undoped GaN layer 18, and a substrate layer 20, such as can be made from sapphire, silicon, or silicon carbide. With the help of the Schottky barrier 14 between the gate metal 16 and the AlGaN barrier, the channel between source 22 and drain 24 can be pinched-off at zero gate bias as long as the AlGaN barrier is thin enough. However, E-mode HFETs fabricated in this manner have poor performance characteristics, such as low transconductance, large on-resistance, and high knee-voltage. This is due to high access resistance. As shown in FIG. 1, the access region between the gate and source also has very low carrier density because of the thin AlGaN barrier. Thus, the access region is also in the E-mode, which needs positive bias to be turned on. To produce E-mode HFETs with low access resistance, a “self-aligned” fabrication process is required, in which only the channel region directly under the gate electrode is in E-mode. Note that gates that are not self-aligned required overlap, which increases device size and stray capacitance.

There have been several attempts at fabrication of E-mode AlGaN/GaN high electron mobility transistors (“HEMTs”). Note that the terms “HEMT” and “HFET” are synonymous. Both are field effect transistors with a junction between two materials with different band gaps, e.g. a heterostructure as the channel. The effect of this heterostructure is to create a very thin layer where the Fermi energy is above the conduction band, giving the channel very low resistance, e.g., “high electron mobility”. As with all the other types of FETs, a voltage applied to the gate alters the conductivity of the thin layer.

Using a thin AlGaN barrier (10 nm), Khan et al. produced an E-mode HEMT with a peak transconductance of 23 mS/mm.

Another attempt to fabricate an E-mode HFET in an AlGaN/GaN system was reported by Hu et al., “Enhancement mode AlGaN/GaN HFET with selectively grown PN junction gate,” April 2000, IEE Electronics Letters, Vol. 36, No. 8, pp. 753-754, which is hereby incorporated by reference in its entirety. In this work a selectively-grown P/N junction gate is used. The selectively-grown P-type layer is able to raise the potential of the channel and therefore deplete the carriers from the channel at zero gate bias. However, such an approach is not self-aligned and the problem of large access resistance persists.

Another attempt to fabricate an E-mode HFET in an AlGaN/GaN system was reported by Moon et al. who used inductively coupled plasma reactive ion etching (“ICP-RIE”) to carry out gate recess-etching. See Jeong S. Moon et al., “Submicron Enhancement-Mode AlGaN/GaN HEMTs,” June 2002, Digest of 60th Device Research Conference, pp. 23-24, which is hereby incorporated by reference in its entirety.

Kumar el at. used a similar approach. Note that the AlGaN barrier under the gate can be thinned by the recess-etching and the threshold voltage is then raised to a positive value. However, ICP-RIE can cause serious damage to the AlGaN barrier and results in increased gate leakage current. To remove ICP-RIE induced damage, the recess-etching patterns must be removed and followed by high-temperature (about 700° C.) annealing. Thus, the gate patterns have to be created again through photo-lithography which cannot be accurately aligned with the recess-etching windows previously generated in the gate recess stage. Therefore, the process requires double photolithography, or alignment, and is not self-aligned. To ensure that the recess windows are fully covered by the gate electrodes, the gate electrodes need to be larger than the recess windows, resulting in a larger gate size, as mentioned earlier. Another problem associated with the ICP-RIE etching is the poor uniformity in the etching depth, which is undesirable for integrated circuits because it severely affects the uniformity in the threshold voltage.

Another approach used gate metals, e.g. Platinum (“Pt”) or Molybdenum (“Mo”), that have larger work function and have the tendency of reacting with III/V compound semiconductors. (Work function refers to the energy required to release an electron as it passes through the surface of a metal.) For example, a Pt-based buried gate technology was previously used in realizing E-mode indium-aluminum-arsenide/indium-gallium-arsenide HFETs. For AlGaN/GaN HFETs, Endoh et al. created an E-mode HFET from a D-mode HFET with a Pt-based gate electrode. Through high temperature gate annealing, the gate metal front can be made to sink into the AlGaN barrier and effectively reduce the barrier thickness and raise the threshold voltage to a positive value. Such an approach requires a D-mode HFET with a threshold voltage already close to zero because the sinking depth of the Pt-gate is limited. However, for monolithically-integrated E/D-mode HFET circuits, it is desirable for the D-mode HFET (which serves as the load) to have a more negative threshold voltage.

U.S. Patent Application 20030218183 entitled “High Power-Low Noise Microwave GaN Heterostructure Field Effect transistor” to Miroslav Micovic et al., discloses a gate recess technique as one existing process technique to fabricate E-mode HFETs. However, in an AlGaN/GaN HFET, because of the lack of effective wet etching techniques, the recess etching is carried out by dry etching. For example, ICP-RIE is used for the recess etching, as mentioned earlier, with the accompanying severe damage and defects to the device.

U.S. Patent Application 2005059197 entitled “Semiconductor Device and Method for Manufacturing the Same” to Yoshimi Yamashita et al., discloses a technique using the approach of using gate metals with larger work function for fabricating E-mode HFETs in GaN-based material systems. However, no metal has been found to have a work function larger than 1 electron volt (“eV”). As a result, in order to fabricate an E-mode HFET using the method of Yamashita et al., a sample which already exhibits a threshold voltage closer to zero volts is needed. This is not suitable for the integration of E-mode and D-mode HEMTs, which are both required for DCFL circuits.

The gate recess technique has also been used to implement monolithic integration of E/D HFETs in AlGaN/GaN heterostructures. As described above, such approach requires a two-mask gate process, introducing extra process steps and cost as compared to a single-mask gate process.

To achieve high density and high-uniformity in the E/D HEMT integration, the three-dimensional mesas impose serious limits to photolithography and interconnects. Thus, a planar process is desired, as seen from the successful development of the commercial GaAs MESFET integrated circuits.

Additionally, due to the lack of P-channel AlGaN/GaN HEMTs, a circuit configuration similar to the based on CMOS cannot be implemented at present. Using N-channel HEMTs, direct-coupled field-effect transistor (“FET”) logic (DCFL), as shown in FIG. 1A, which features integrated enhancement/depletion-mode (“E/D-mode”) HEMTs, offers the simplest circuit configuration.

Because of the heretofore lack of a compatible integration process for both D-mode and E-mode AlGaN/GaN HEMTs. Hussain et al. made a trade-off and used an all-D-mode-HEMT technolgoy and buffered FET logic (“BFL”) configuration to realize an inverter and a 31-stage ring oscillator that includes 217 transistors and two negative voltage supplies.

Based on low damage Cl₂-based ICP-RIE technology, Microvic et al. applied the technology of two-step gate recess etching and used plasma-enhanced chemical vapor deposition (“PECVD”)-grown silicon nitride as the gate metal deposition mask to fabricate the E-mode GaN HEMTs, which are integrated with the D-mode GaN HEMT. They showed a propagation delay of 127 ps/stage at a drain bias voltage of 1.2 V for a 31-stage DCFL ring oscillator with the 0.15-μm-gate technology.

Monolithic Integration of Enhancement-Mode and Depletion-Mode AlGaN/GaN HFETs

The present application sets forth devices, circuits, and systems with monolithic integration of D-mode and E-mode HFETs, as well as methods for building them. In one class of embodiments, a patterned plasma treatment is used to introduce a fixed charge into the wide-bandgap material under the gates of only some devices. In this example, D-mode HFETs are defined without plasma treatment to the barrier layer under the gate, and the E-mode HFETs are defined with plasma treatment to the barrier layer under the gate.

The disclosed innovations in various embodiments, provide one or more of at least the following advantages:

-   -   Allows for monolithic integration of enhancement-mode and         depletion-mode AlGaN/GaN HEMTs for the implementation of         complete circuits in DCFL or other logic families.     -   Provides a self-aligned approach to fabricating E/D-mode         AlGaN/GaN HEMTs with low on-resistance, low knee-voltage, and         high extrinsic transconductance.     -   Provides a method to manufacture self-aligned E/D-mode HFETs         using readily available microelectronic fabrication equipment.     -   Provides a method enabling the production of reproducible and         stable E/D-mode HEMT devices, particularly suitable for high         temperature digital circuit applications.     -   Provides for allowing large supply voltage in DCFL circuit to         improve the noise margin and to shorten gate delay.     -   Provides for large input voltage swings to eliminate the need         for logic level adjustment between adjacent stages in IC's.     -   Provides a planar integration for E/D-mode HEMTs without any         mesa etching or gate recess etching.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosed innovations will be described with reference to the accompanying drawings, which show important sample embodiments of the present innovations and which are incorporated in the specification hereof by reference, wherein:

FIG. 1 shows a prior art E-mode HFET.

FIG. 1A shows a DCFL circuit schematic for an E/D inverter.

FIG. 1B shows a DCFL circuit for a ring oscillator.

FIG. 1C shows a photomicrograph of an inverter as one embodiment of the present innovations.

FIG. 1D shows a photomicrograph of a ring oscillator as one embodiment of the present innovations.

FIG. 2 shows transfer characteristics of a conventional D-mode HEMT, an E-mode HEMT without the benefit of the present innovations, and one embodiment of the present innovations.

FIGS. 3A through 3F show one embodiment of a process of fabricating an E-mode AlGaN/GaN HFET.

FIG. 4A shows I-V output characteristics for one embodiment of an E-mode AlGaN/GaN HFET.

FIG. 4B shows I_(g)-V_(gs) characteristics for one embodiment of an E-mode AlGaN/GaN HFET.

FIG. 5 shows fluorine ion concentration profiles as measured by “SIMS” for one embodiment of an E-mode AlGaN/GaN HFET.

FIG. 6 shows the cross section of one embodiment of the present innovations prior to implantation of fluorine ions.

FIG. 7 shows fluorine ion concentration profiles as measured by “SIMS” for various embodiments.

FIGS. 7A and 7B show fluorine ion concentration profiles as measured by “SIMS” for various embodiments.

FIG. 8A shows the I_(d) versus V_(gs) transfer characteristics of E-mode AlGaN/GaN HFETs after different CF₄ plasma-treatment conditions.

FIG. 8B shows the g_(m) versus V_(gs) transfer characteristics of E-mode AlGaN/GaN HFETs after different CF₄ plasma-treatment conditions.

FIG. 9 shows the extracted barrier heights and ideality factors of gate Schottky diodes with different CF₄ plasma treatments.

FIG. 10 shows the V_(th) dependence on plasma power and treatment time for various E-mode AlGaN/GaN HFETs.

FIG. 11 shows an AFM image depicting the insignificant etching effect of the CF₄ plasma treatment on the AlGaN layer.

FIG. 12A shows the DC I_(d) versus V_(gs) transfer characteristics for various E-mode AlGaN/GaN HFET embodiments.

FIG. 12B shows the DC g_(m) versus V_(gs) transfer characteristics for various E-mode AlGaN/GaN HFET embodiments.

FIG. 13 shows the DC output characteristics for one E-mode AlGaN/GaN HFET embodiment.

FIG. 14A shows both reverse and forward gate currents with different CF₄ plasma treatments for various embodiments of an E-mode AlGaN/GaN HFET.

FIG. 14B shows enlarged and forward gate currents with different CF₄ plasma treatments for various embodiments of an E-mode AlGaN/GaN HFET.

FIG. 15 shows dependencies of f_(t) and f_(max) on gate bias, where V_(ds) is fixed at 12V.

FIG. 16 shows on-wafer measured f_(t) and f_(max) with different CF₄ plasma treatments.

FIGS. 17A through 17F show a sample process of fabricating an E-mode Si₃N₄AlGaN/GaN MISHFET.

FIG. 18 shows sample DC output characteristics.

FIG. 19A shows the transfer characteristics.

FIG. 19B shows gate leakage currents.

FIG. 20 shows pulse measurements.

FIG. 21 shows small signal RF characteristics.

FIG. 22 shows simulated conduction-band diagrams of conventional D-mode AlGaN/GaN HEMT without CF₄ plasma treatment.

FIG. 23 shows simulated conduction-band diagrams of an E-mode AlGaN/GaN HEMT with a CF₄ plasma treatment.

FIG. 24 shows the electron concentration of a conventional D-mode AlGaN/GaN HEMT without CF₄ plasma treatment and of an E-mode AlGaN/GaN HEMT with CF₄ plasma treatment.

FIG. 25 shows one embodiment for a process flow of monolithic integration of E-mode and D-mode HEMTs for an inverter according to the present innovations.

FIGS. 26A through 26F show a sample process flow for monolithic integration of E-mode and D-mode HFETs.

FIG. 27 shows a planar process flow for monolithic integration.

FIG. 28 shows another sample process flow for E/D-mode HEMTs.

FIG. 29 shows DC output characteristics of an D-HEMT and an E-HEMT fabricated by a planar process.

FIG. 30 compares transfer characteristics of the planar process with those of a conventional process.

FIG. 31 shows static voltage transfer characteristics of an E/D HEMT inverter fabricated by a planar fabrication process.

FIG. 32 show an epitaxial structure for the HEMTs used in a sample embodiment.

FIG. 33 show the integrated process flow of monolithic integration of E-mode and D-mode HEMTs for a monolithic inverter.

FIG. 34 show sample geometry parameters for inverters and ring oscillators.

FIG. 35 show DC I-V transfer characteristics and output characteristics of sample D-mode and E-mode AlGaN/GaN HEMTs as disclosed.

FIG. 36 shows performances of fabricated E- and D-mode AlGaN/GaN HEMTs.

FIG. 37 show I_(g)-V_(g) characteristics of both D- and E-mode HEMTs and simulated conduction-edge band diagrams under the gate electrode for a D-mode HEMT and an E-mode HEMT.

FIG. 38 shows static voltage transfer characteristics for a conventional E/D HEMT inverter.

FIG. 39 shows static voltage transfer characteristics of E/D HEMT inverters with β=6.7, 10, 25, and 50 according to various disclosed embodiments.

FIG. 40 shows noise margins for inverters with different beta values.

FIG. 41 shows static voltage transfer characteristics of E/D HEMT inverters with β=10 measured at different supply voltages.

FIG. 42 show noise margins measured at different V_(DD)'s for an inverter with β=10.

FIG. 43 shows load and input current of an inverter with β=10 at V_(DD)=2.5 V, according to a sample embodiment.

FIG. 44 shows a frequency spectrum, and FIG. 45 shows time-domain characteristics, of a 17-stage ring oscillator with β=10 biased at V_(DD)=3.5 V.

FIG. 46 shows dependences of propagation delay and power-delay product on the supply voltage for one circuit embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The numerous innovative teachings of the present application will be described with particular reference to the presently preferred embodiment (by way of example, and not of limitation).

FIGS. 3A through 3F illustrate the process of fabricating an enhancement-mode III-nitride HFET according to a first embodiment of the present innovations. FIG. 3A illustrates a preferred epitaxial structure of the present innovations, where the reference numerals 110, 120, 130 and 140 denote substrate (e.g. sapphire, silicon or SiC), nucleation layer (low temperature grown GaN nucleation layer, AlGaN or AlN), high temperature-grown GaN buffer layer, and Al_(x)Ga_(1-x)N barrier layer including the modulation doped carrier supply layer. The manufacturing method of enhancement mode III-nitride HFET of one embodiment is described below. The mesa isolation is formed using Cl₂/He plasma dry etching followed by the source/drain ohmic contact formation 160 with Ti, Al, Ni and Au annealed at 850 ° C. for 45 seconds as shown in FIG. 3B. Next, photoresist 170 is patterned with the gate windows exposed. Then, the fluorine ions are incorporated into Al_(x)Ga_(1-x)N barrier layer by, for examples, either fluorine plasma treatment or fluorine ions implantation as shown in FIG. 3C. The gate electrode 180 is formed on the barrier layer 140 by depositing and lift-off Ni and Au as shown in FIG. 3D. Thereafter, post-gate RTA is conducted at 400-450° C. for 10 minutes. A passivation layer 190 is grown on the top of the wafer as shown in FIG. 3E. Finally, the contact pads are opened by removing portions of the passivation layer on the contact pads as shown in FIG. 3F.

EXAMPLE 1

An AlGaN/GaN HEMT structure was grown on a (0001) sapphire substrate in an Aixtron AIX 2000 HT metal-organic chemical vapor deposition (MOCVD) system. The HEMT structure consists of a low-temperature GaN nucleation layer, a 2.5-m-thick unintentionally doped GaN buffer layer and an AlGaN barrier layer with nominal 30% Al composition. The barrier layer consists of a 3-nm undoped spacer, a 15-nm carrier supplier layer doped at 2.5×10¹⁸ cm⁻³, and a 2-nm undoped cap layer. Room temperature Hall measurements of the structure yield an electron sheet density of 1.3×10¹³ cm⁻² and an electron mobility of 1000 cm²/Vs. The device mesa was formed using Cl₂/He plasma dry etching in an STS ICP-RIE system followed by the source/drain ohmic contact formation with Ti/Al/Ni/Au annealed at 850° C. for 45 seconds. The ohmic contact resistance was typically measured to be 0.8 ohm-mm.

After gate windows with 1 nm length were opened by contact photolithography, the sample was treated by CF₄ plasma in an RIE system at an RF plasma power of 150 W for 150 seconds. Pressure of the treatment is typically 50 mTorr. The typical depth distribution profile of the fluorine ions thus incorporated via the treatment is Gaussian, and the typical depth when the fluorine concentration drops from the peak by one order of magnitude is 20 nm. Note that ion implantation is another method for incorporating the fluorine ions, and it is estimated that an energy of about 10 KeV would be required.

Ni/Au electron-beam evaporation and liftoff were carried out subsequently to form the gate electrodes. The plasma treated gate region and the gate electrode were self-aligned. Post-gate RTA was conducted at 400° C. for 10 minutes. This RTA temperature was chosen because RTA at temperatures higher than 500° C. can degrade both the gate Schottky contract and the source/drain ohmic contacts. The devices have a source-gate spacing of L_(sg)=1 μm and a gate-drain spacing of L_(gd)=2 μm. D-mode HEMTs were also fabricated on the same sample without plasma treatment to the gate regions.

FIG. 2 shows the transfer characteristics of both D-mode and E-mode (before and after post-gate annealing) AlGaN/GaN HEMTs. Defining V_(th) as the gate bias intercept of the linear extrapolation of drain current at the point of peak transconductance (g_(m)), the V_(th) of the E-mode device was determined to be 0.9 V, while the V_(th) of the D-mode device is −4.0 V. More than 4 V of V_(th) shift was achieved by the plasma treatment. At V_(gs)=0, the transconductance reaches zero, indicating a true E-mode operation. The drain current is well pinched-off and shows a leakage of 28 μA/mm at V_(ds)=6 V, the smallest value reported up to date for E-mode AlGaN/GaN HEMTs. The peak g_(m) is 151 mS/mm for the D-mode HEMT and 148 mS/mm for the E-mode HEMT, respectively. The maximum drain current (I_(max)) reaches 313 mA/mm at the gate bias (V_(gs)) of 3 V for the E-mode HEMT. Comparison of the current-voltage (I-V) characteristics of E-mode device before and after RTA suggests that RTA at 400° C. for 10 minutes plays an important role in recovering the damages induced during the plasma treatment and achieving high current density and transconductance. FIG. 4A shows the output curves of the E-mode device before and after the RTA process. No change in threshold voltage was observed after the RTA. At a V_(gs) of 2.5 V, the saturation drain current (247 mA/mm) of E-mode device after RTA at 400° C. is 85% higher than that (133 mA/mm) before RTA, and the knee voltage of the E-mode device with RTA is 2.2 V, where the drain current is 95% saturation drain current. The off-state drain breakdown voltage at V_(gs)=0V is larger than 80 V, showing no degradation compared to that observed in the D-mode HEMTs. FIG. 4B shows I_(g)/V_(gs) curves of these three devices. Lower gate leakage currents were achieved for E-mode HEMT, especially after RTA.

In order to investigate the mechanisms of the V_(th) shift by CF₄ plasma treatment, secondary ion mass spectrum (SIMS) measurements were carried out on accompanying samples to monitor the atomic composition changes of the CF₄ plasma treated AlGaN/GaN materials. In addition to Al, Ga, and N, significant amount of fluorine atoms were detected in the plasma treated sample. FIG. 5 shows the fluorine atom concentration profile of the sample treated at a CF₄ plasma power of 150 W for 2.5 minutes. The concentration of fluorine atoms is the highest near the AlGaN surface and drops by one order of magnitude in the channel. It can be deduced that the fluorine ions produced by the CF₄ plasma were incorporated into the sample surface, similar to the effects of plasma immersion ion implantation (“PIII”), a technique developed to realize ultra-shallow junctions in advanced silicon technology. Because of the strong electro-negativity of the fluorine ions, the incorporated fluorine ions can provide immobile negative charges in the AlGaN barrier and effectively deplete the electrons in the channel. With enough fluorine ions incorporated in the AlGaN barrier, the D-mode HEMT can be converted to an E-mode HEMT. The CF₄ plasma treatment can result in a threshold voltage shift as large as 4.9 V. After RTA at 400° C. for 10 minutes, the peak fluorine atom concentration near the AlGaN surface is unchanged while that around the AlGaN/GaN interface experiences more significant reduction. It should be noted, however, SIMS measurement results from different runs do not offer accurate quantitative comparison because of the lack of reference criterion. Nevertheless, the minute change in V_(th) before and after RTA indicates that the total number of fluorine ions incorporated into the AlGaN barrier is near constant before and after RTA, while the plasma damages are significantly recovered by the RTA. The lower gate reverse leakage currents of an E-mode HEMT can be attributed to an upward band bending of the AlGaN layer as a result of fluorine ion incorporation. After the RTA process, the defects at the interface of metal and AlGaN induced by CF₄ were recovered, leading to further suppression of gate leakage current. From the atomic force microscopy (“AFM”) measurement conducted on a patterned sample, it was observed that the plasma treatment only results in a 0.8 nm reduction in the overall AlGaN barrier layer (20 nm thick).

On-wafer small-signal RF characteristics of D-mode and E-mode AlGaN/GaN HEMTs were measured from 0.1 to 39.1 GHz. The current gain and maximum stable gain/maximum available gain (MSG/MAG) of both types of devices with 1 μm-long gate were derived from measured S-parameters as a function of frequency, as shown in FIG. 5. At V_(ds)=12 and V_(gs)=1.9 V, a current gain cutoff frequency (ƒ_(T)) of 10.1 GHz and a power gain cutoff frequency (ƒ_(MAX)) of 34.3 GHz were obtained for the E-mode AlGaN/GaN HEMT, a little lower than that of its D-mode counterpart, whose and were measured at the drain bias of 12 V and gate bias of −3 V to be 13.1 and 37.1 GHz, respectively.

One advantage of the present innovations is that the E-mode HFET with fluorine ions incorporated in barrier layer can stand a larger gate bias (>3V) corresponding to a larger input voltage swing.

Also, thermal reliability testing has shown that the fluorine ion incorporation in the AlGaN barrier is stable up to 700° C. However, the Schottky contact, made of nickel, is only stable up to 500° C. Therefore, the application temperature range is up to 500° C. unless another Schottky contact technique is used. Tungsten gate is one possible candidate.

In FIG. 7, the effect of different post-gate RTA's on the fluorine atoms' distributions in AlGaN/GaN heterostructures, as measured by SIMS is shown. The untreated device is used as a reference.

It was found that the fluorine ions, which were incorporated into the AlGaN barrier layer by CF₄ plasma treatment, could effectively shift the threshold voltage positively. The fluorine ions' incorporation in the AlGaN layer was confirmed by secondary-ion-mass-spectrum (SIMS) measurements, as shown in FIG. 7. During CF₄ plasma treatment, fluorine ions are implanted into AlGaN/GaN heterostructure in a self-built electrical field stimulated by the RF power.

It is also concluded from the results shown in FIG. 7 that the implanted fluorine ions have a good thermal stability in the AlGaN layer up to 700° C. Deep-level transient spectroscopy (“DLTS”) has been conducted on the HEMT samples treated by CF₄ plasma. The fluorine ions incorporated in the AlGaN barrier appear to introduce a deep-level state that is at least 1.8 eV below the conduction-band minimum. As a result, the fluorine ions are believed to introduce a negatively charged acceptor-like deep level in the AlGaN.

Recent DLTS and photo-conductivity results have revealed that the incorporation of fluorine ions in the AlGaN layer is predominantly substitutional, with the fluorine atoms filling nitrogen vacancies in the AlGaN layer.

Note that in SIMS plots such as FIG. 7, it is difficult to make accurate calculation of concentration from SIMS measurement because the beam size is not known. However, based on the bandstructure and threshold voltage calculation, the peak value of the F concentration can be as high as about 1×20 cm⁻³.

In FIG. 7A, the effect of different plasma power levels without RTA on the fluorine atoms' distributions in AlGaN/GaN heterostructures, as measured by SIMS, is shown.

Note that the 200 W and 400 W lines show a “bump” at the interface between the AlGaN/GaN interface. During an incorporation process, the fluorine ions can fill up surface or interface states (or “traps”) producing “anomalous stopping”. Therefore, this indicates there are more traps at the interface. Further, the 600 W and 800 W lines do not show the bump most likely because of the greater penetration depth and overall concentration.

The untreated device is used as a reference. In FIG. 7B, the effect of different post-gate treatment temperatures at a fixed power of 600 W for RTA on the fluorine atoms' distributions in AlGaN/GaN heterostructures, as measured by SIMS, is shown. The untreated device is used as a reference. Note that the distributions in the AlGaN for 700° C. and below show a normal effect of root Dt, but the distribution in the AlGaN layer seems to reflect a very different diffusivity (or perhaps some other activation energy effect). Thus, the data indicates that fluorine ions are more stable in AlGaN than in GaN. Further, the binding energy can be higher, and the fluorine-related energy states are deeper below the conduction band in AlGaN than in GaN.

Sensitivity to plasma treatment parameters was also investigated. Devices were fabricated with different V_(th) values by applying different CF₄ plasma power and treatment times. Five different combinations were used: 100 W for 60 seconds, 150 W for 20 seconds, 150 W for 60 seconds, 150 W for 150 seconds, and 200 W for 60 seconds. For comparison, an HEMT without CF₄ treatment was also fabricated on the same sample and in the same processing run. All the devices were unpassivated in order to avoid any confusion caused by the passivation layer, which may change the stress in the AlGaN layer and alter the piezoelectric polarization. All the HEMT devices have a gate length of 1 μm, a source-gate spacing of L_(sg)=1 μm and a gate-drain spacing of L_(gd)=2 μm. DC current-voltage (I-V) characteristics of the fabricated devices were measured using an HP4156A parameter analyzer. Transfer characteristics and transconductance (g_(m)) characteristics are shown in FIGS. 8A and 8B, respectively. Taking the conventional HEMT (i.e., without CF₄ plasma treatment) as the baseline devices, the threshold voltage of all the other CF₄ plasma-treated HEMTs are shifted to the positive direction. Defining V_(th) as the gate-bias intercept of the linear extrapolation of the drain-current at the point of peak transconductance (g_(m)), the V_(th) of all the devices were extracted and listed in FIG. 9. For the conventional HEMT, V_(th) is −4 V. For the HEMT treated by CF₄ plasma at 150 W for 150 seconds, the V_(th) is 0.9 V, which corresponds to the E-mode HEMT. A maximum V_(th) shift of 4.9 V was achieved. In order to further reveal the effects of CF₄ plasma treatment, the dependencies of V_(th) on both CF₄ plasma treatment time and RF power are plotted in FIG. 10. As the plasma power is increased and as longer treatment time are utilized, larger shifts in V_(th) are effected. With the increase in the plasma treatment time, more fluorine ions were implated into AlGaN layer. The increased fluorine ion concentration leads to a reduced electron density in the channel, and causes the positive shift of V_(th). When the plasma power increases, fluorine ions obtain a higher energy and fluorine ion flux increases due to the enhanced ionization rate of CF₄. With higher energy, fluorine ions can reach at a deeper depth closer to the channel. The closer the fluorine ions are to the channel, the more effective they at depleting 2DEG, and a larger shaft in V_(th) is achieved. The increased fluorine ions flux has the same effect on V_(th) as the increase of the plasma treatment time by raising the fluorine atoms concentration in AlGaN layer. It should be noted that the nearly linear V_(th) versus time and V_(th) versus power relationships imply the possibilities of a precise control of V_(th) of AlGaN/GaN HEMTs. Although the V_(th) is shifted by CF₄ plasma treatment, the g_(m) is not degraded. As shown in FIG. 8B, all the devices' maximum g_(m) are in the range of 149-166 mS/mm, except for that treated at 150 W for 60 seconds, which has a higher peak g_(m) of 186 mS/mm. It is suspected that this singularity point was caused by the non-uniformity in epitaxial growth. Confirmed by an AFM measurement conducted on a CF₄-treated patterned sample (with part of the sample treated and other parts protected from the plasma treatment), the CF₄ plasma treatment only results in an AlGaN-thickness reduction of less than 1 μm, as shown in FIG. 11. Thus, the almost constant transconductance indicates that the 2DEG mobility in the channel is maintained in the device fabrication according to the present innovations. A key step in maintaining the transconductance is the post-gate annealing process.

Recovery of Plasma-Induced Damages by Post-Gate Annealing

As previously discussed, the plasma normally induces damages and creates defects in semiconductor materials, and consequently degrades carriers' mobility. RTA is an effective method to repair these damages and recover the mobility. In the CF₄ plasma-treated AlGaN/GaN HEMTs, drain-current and transconductance degradation occurs just after the plasma treatment. In FIGS. 12A and 12B, the drain-current and transconductance measured on an untreated device and a treated device (200 W, 60 seconds) before and after RTA (400° C. for 10 minutes) are plotted. FIG. 13 compares the output characteristics of the treated device before and after RTA. The drain-current was 76% and the transconductance was 51% higher after the RTA in the treated device. The RTA process can recover majority of the mobility degradation in the plasma-treated device while showing an insignificant effect on the conventional untreated device. Therefore, the recovery of I_(d) and g_(m) in the CF₄ plasma-treated device is the result of the effective recovery of the 2DEG mobility at this RTA condition. Compared to a higher annealing temperature of 700° C., which is needed to recover damages induced by chlorine-based ICP-RIE in the case of recessed gate, this lower RTA temperature implies that the CF₄ plasma treatment creates lower damages than the chlorine-based ICP-RIE. It also enables the RTA process to be carried out after the gate deposition, fulfilling the goal of a self-aligned process. If the previous definition of V_(th) is used, the V_(th) of the CF₄ plasma-treated device seems to be shifted from 0.03 to −0.29 V after the RTA. When the start point of g_(m), as shown in FIG. 12B, or the start point of I_(d) at the logarithm scale, as shown in the inset of FIG. 12A, is used as the criteria to evaluate V_(th), the V_(th) of the CF₄ plasma-treated device is not changed after the RTA. The good thermal stability of V_(th) is consistent with the previously mentioned good thermal stability of fluorine atoms in AlGaN layer.

Suppression of Schottky Gate-Leakage Current

AlGaN/GaN HEMTs always show much higher reverse gate leakage currents than the values theoretically predicted by the thermionic-emission (“TE”) model. The higher gate currents degrade the device's noise performance and raise the standby power consumption. In particular, forward gate currents limit the gate input voltage swing, hence the maximum drain-current. Other approaches have been attempted to suppress gate currents of AlGaN/GaN HEMTs. These efforts include using the gate metal with higher work function, using copper, modifying the HEMTs structure (such as adding a GaN cap), or diversion to metal-insulator-semiconductor heterostructure field-effect transistors (MISHFETs). In the CF₄ plasma-treated AlGaN/GaN HEMTs of the present innovations, suppressions of gate currents in both reverse and forward bias regions can be achieved. Gate-current suppression show dependencies on CF₄ plasma-treatment conditions.

FIGS. 14A and 14B shows gate currents of AlGaN/GaN HEMTs with different CF₄ plasma treatments. FIG. 14B is the enlarged plot of the forward gate bias region. In reverse bias region, compared to the conventional HEMT without CF₄ plasma treatment, the gate-leakage currents of all the CF₄ plasma-treated AlGaN/GaN HEMTs decreased. At V_(g)=−20 V, the gate-leakage current drops by more than four orders of magnitude from 1.2×10⁻² A/mm for conventional HEMT to 7×10⁻⁷ A/mm for the AlGaN/GaN HEMT plasma treated at 200 W, 60 seconds. In the forward region, the gate currents of all the CF₄ plasma-treated AlGaN/GaN HEMTs also decrease. As a result, the turn-on voltages of the gate Schottky diode are extended, and the gate input voltage swings are increased. Using 1 mA/mm as the criterion, the turn-on voltage of the gate Schottky diode increases from 1 V for conventional HEMT to 1.75 V for the CF₄ plasma-treated AlGaN/GaN HEMT at 200 W for 60 seconds.

The suppression of the gate-leakage current in the CF₄ plasma-treated AlGaN/GaN HEMT can be explained as follows. During CF₄ plasma treatment, fluorine ions are incorporated into the AlGaN layer. These ions with a strong electronegativity act as immobile negative charges that cause the upward conduction-band bending in the AlGaN barrier layer due to the electrostatic induction effect. Thus, an additional barrier height Φ_(F), as shown in FIG. 23 is formed, and the effective metal-semiconductor barrier height is increased from Φ_(B) to Φ_(B)+Φ_(F). This enhanced barrier height can effectively suppress the gate Schottky diode current in both reverse and forward bias regions. With higher plasma power and longer treatment time, the fluorine ion concentration in the AlGaN layer increases, and the effective barrier height is raised further, leading to a more significant gate-current suppression. In FIG. 9 the effective barrier heights and ideality factors that were extracted from the forward region of the measured gate currents by using the TE model are detailed. The effective barrier height of conventional HEMT is 0.4 eV, while the effective barrier height increases to 0.9 eV for the CF₄ plasma-treated HEMT at 200 W for 60 seconds. The effective barrier heights of the CF₄ plasma-treated HEMT also show a trend of increase with the plasma power and treatment time, except for the HEMT treated at 150 W for 20 seconds, which has a relatively higher effective barrier height. This exception is thought to be due to the process variations. The facts that the extracted effective barrier height is much lower than the theoretically predicted values and very large ideality factors (>2.4) indicates that the gate currents of fabricated AlGaN/GaN HEMTs are not dominated by the TE mechanism but other mechanisms, such as vertical tunneling, surface barrier thinning, and trap-assisted tunneling. Thus, the barrier heights can ideality factors, which are extracted by using the TE model, are not accurate. Nevertheless, they provide sufficient qualitative information for explaining the mechanism of the gate-current suppression in CF₄ plasma-treated AlGaN/GaN HEMTs.

Dynamic I-V characterizations were conducted by using all Accent DIVA D265 system to investigate the effects of CF₄ plasma treatment on drain-current dispersion. The pulse width is 0.2 μs and the pulse separation is 1 ms. The quiescent point is at V_(GS) slightly (˜0.5 V) below the pinch-off and V_(DS)=15 V. Compared to static I-V characteristics, the maximum drain-current of conventional D-mode HEMT dropped by 63%, while that of E-mode HEMT with CF₄ plasma treatment at 150 W for 150 seconds dropped by 6%.

The alleviation of drain-current drops for E-mode HEMT is likely due to a raised gate bias of the quiescent point (V_(GS)=0 V for E-mode HEMT, V_(GS)=−4.5 V for D-mode HEMT).

RF Small-Signal Characteristics

On-wafer small-signal RF characterization of the fabricated AlGaN/GaN HEMTs were carried out at the frequency range of 0.1-39.1 GHz using Cascade microwave probes and an Agilent 8722ES network analyzer. Open-pad de-embeddings with the S-parameters of dummy pads were carried out to eliminate a parasitic capacitance of the probing pads. The current gain and maximum stable gain/maximum available gain (MSG/MAG) of all devices with 1-μm long gate were derived from the de-embedded S-parameters as a function of frequency. The current cutoff frequency (ƒ_(t)) and maximum oscillation frequency (ƒ_(max)) were extracted from current gains and MSG/MAGs at unit gain. It has been observed that the intrinsic f_(t) and f_(max) are generally 10-15% higher than the extrinsic ones without the de-embeddings process. The dependencies of ƒ_(t) and ƒ_(max) on the gate bias are shown in FIG. 15 for the E-mode HEMT. Both ƒ_(t) and ƒ_(max) are relatively constant at both low and high gate bias, indicating a good linearity. FIG. 16 lists f_(t) and f_(max) of all samples. For the conventional HEMT, ƒ_(t) and ƒ_(max) are 13.1 and 37.1 GHz, while for the CF₄ plasma-treated HEMT, ƒ_(t) and ƒ_(max) are approximately 10 and 34 GHz, slightly lower than that of the conventional HEMT, except for the HEMT treated at 150 W for 60 seconds. This higher ƒ_(t) and ƒ_(max) in the 150 W/60 second device are constant with the higher g_(m) presented before, and are attributed to a material non-uniformity and process variation. The slightly lower ƒ_(t) and ƒ_(max) in the CF₄ plasma-treated HEMTs indicate that the post-gate RTA at 400° C. can effectively recover the 2DEG mobility degraded by the plasma treatment, but the recovery is less than 100%. It suggests that the optimization of the RTA temperature and time is needed to further improve the 2DEG mobility, while not degrading the gate Schottky contact.

MISHFETs

In another embodiment, E-mode Si₃N₄/AlGaN/GaN MISHFET were constructed with a two-step Si₃N₄ process which features a thin layer of Si₃N₄ (15 nm) under the gate and a thick layer of Si₃N₄ (about 125 nm) in the access region. Fluorine-based plasma treatment was used to convert the device from D-mode to E-mode. The E-mode MISHFETs with 1-μm long gate footprint exhibited a threshold voltage of 2 V, a forward turn-on gate bias of 6.8 V (compared to about a 3 V realized in E-mode AlGaN/GaN HEMTs) and a maximum current density of 420 mA/mm.

The AlGaN/GaN HFET structure was used in this example was grown on (0001) sapphire substrates in an Aixtron AIX 2000 HT MOCVD system. The HFET structure consists of a 50-nm thick low temperature GaN nucleation layer, a 2.5-μm thick not-intentionally doped GaN buffer layer, and an AlGaN barrier layer with nominal 30% Al composition. The barrier layer is composed of a 3-nm undoped spacer, a 16-nm carrier supplier layer doped at 2×10¹⁸ cm⁻³, and a 2-nm undoped cap layer. The capacitance-voltage (“C-V”) measurement by mercury probe yields an initial threshold voltage of −4 V for this sample. The process flow is illustrated in FIGS. 17A through 17F. The device mesa is formed using Cl₂/He plasma dry etching in an STS ICP-RIE system followed by the source/drain ohmic contact information with Ti/Al/Ni/Au (20 nm/150 nm/50 nm/80 nm) annealed at 850° C. for 30 seconds, as shown in FIG. 17A. Then, the first Si₃N₄ layer (about 125 nm) is deposited on the sample by plasma enhanced chemical vapor deposition (PECVD) as in FIG. 17B. After gate windows with 1-μm length are opened by photolithography, the sample was put in an RIE system under CF₄ plasma treatment, which removed the Si₃N₄ and incorporated fluorine ions in the AlGaN. The RF power of the plasma was 150 W, as shown in FIG. 17C. The gas flow was controlled to be 150 sccm, and the total etching and treatment time is 190 seconds. After removing the photoresist, the second Si₃N₄ film (about 15 nm) was deposited by PECVD to form the insulating layer between gate metal and AlGaN as in FIG. 17D. Subsequently, the Si₃N₄ layer was patterned and etched to open windows in the source and drain ohmic contact regions, as shown in FIG. 17E. Next, the 2-μm long gate electrodes were defined by photolithography followed by e-beam evaporation of Ni/Au (˜50 nm/300 nm) and liftoff as in FIG. 17F. To ensure that the gate electrode covers the entire plasma-treated region, the metal gate length (2 μm) was chosen to be larger than the treated gate area (1 μm), leading to a T-gate configuration. The gate overhang in the source/drain access regions is insulated from the AlGaN layer by the thick Si₃N₄ layer, keeping the gate capacitances at low level. Finally, the whole sample was annealed at 400° C. for 10 minutes to repair the plasma-induced damage in the AlGaN barrier and channel. Measured from the foot of gate, the gate-source and gate-drain spacings are both 1.5 μm. The E-mode MISHFETs are designed with gate width of 10 μm for dc testing and 100 μm for RF characterizations.

The constructed device was then characterized. The DC output characteristics of the E-mode MISHFETs are plotted in FIG. 18. The devices exhibit a peak current density of about 420 mA/mm, an ON-resistance of about 5.67 Ω·mm and a knee voltage of about 3.3 V at V_(GS)=7 V. FIG. 19A shows the transfer characteristics of the same device with 1×10-μm gate dimension. It can be seen that the V_(th) is about 2 V, indicating a 6-V shift of V_(th) (compared to a conventional D-mode HFET) achieved by the insertion of the Si₃N₄ insulator and plasma treatment. The peak transconductance gm is about 125 mS/mm. FIG. 19B shows the gate leakage current at both the negative bias and forward bias. The forward bias turn-on voltage for the gate is about 6.8 V, providing a much larger gate bias swing compared to the E-mode HFETs. Pulse measurements were taken on the E-mode MISHFETs with 1×100-μm gate dimensions with a pulse length of 0.2 μs and a pulse separation of 1 ms. The quiescent bias point is chosen at V_(GS)=0 V (below V_(th)) and V_(DS)=20 V. FIG. 20 shows that the pulsed peak current is higher than the static one, indicating no current collapse in the device. The static maximum current density of the large device with the a 100-μm gate width is about 330 mA/mm, smaller than the device with 10-μm gate width (about 420 mA/mm). The lower peak current density in the larger device is due to the self-heating effect that lowers the current density. Since little self-heating occurs during pulse measurements, the maximum current for the 100-μm wide device can reach the same level as the 10-μm wide device. On wafer small-signal RF characteristics were performed from 0.1 to 39.1 GHz on the 100-μm wide E-mode MISHFETs at V_(DS)=10 V. As shown in FIG. 21, the maximum current gain cutoff frequency (f_(T)) and power gain cutoff frequency (f_(max)) are 13.3 and 23.3 GHz, respectively. When the gate bias is 7 V, the small-signal RF performance does not significantly degrade, with an f_(T) of 13.1 GHz and an f_(max) of 20.7 GHz, indicating that the Si₃N₄ insulator offers an excellent insulation between gate metal and semiconductor.

Models

A theoretical characterization model was developed for some of the present innovations. For a conventional AlGaN/GaN HEMT with silicon modulation doped layer, as shown in FIG. 7, the polarization charge need to be taken into account in the calculation of HEMTs threshold voltage. Modified from a generally used formula by taking into account the effects of charge polarization, surface and buffer traps, the threshold voltage of the AlGaN/GaN HEMT can be expressed as: $\begin{matrix} {V_{th} = {{\phi_{B}/e} - {d\quad{\sigma/ɛ}} - {\Delta\quad{E_{C}/e}} + {E_{f\quad 0}/e} - {\frac{e}{ɛ}{\int_{0}^{d}{{\mathbb{d}x}{\int_{0}^{x}{{N_{si}(x)}{\mathbb{d}x}}}}}} - {e\quad{{dN}_{st}/ɛ}} - {e\quad{N_{b}/{C_{b}.}}}}} & (1) \end{matrix}$ Where the parameters are defined as follows:

φ_(B) is the metal-semiconductor Schottky barrier height.

σ is the overall net (both spontaneous and piezoelectric) polarization charge at the barrier—AlGaN GaN interface.

d is the AlGaN barrier-layer thickness.

N_(si)(x) is the silicon-doping concentration.

ΔE_(c) is the conduction-band offset at the AlGaN/GaN heterostructure.

E_(ƒ0) is the difference between the intrinsic Fermi level and the conduction band edge of the GaN channel.

ε is the dielectric constant of AlGaN.

N_(st) is the net-charged surface traps per unit area.

N_(b) is the effective net-charged buffer traps per unit area. C_(b) is the effective buffer-to-channel capacitance per unit area. The last two terms in equation (1) describe the effects of the surface traps and buffer traps, respectively. The AlGaN surface is at x=0 , and the direction pointing to the channel is the positive direction for the integration. To represent the devices described above, immobile negative charges are introduced into the AlGaN barrier layer under the gate. Because of electrostatic induction, these immobile negative charges can deplete 2DEG in the channel, raise the energy band, and hence modulate V_(th). Including the effect of the negative charges confined in the AlGaN barrier, the modified threshold voltage from equation (1) is given by: $\begin{matrix} {V_{th} = {{\phi_{B}/e} - {d\quad{\sigma/ɛ}} - {\Delta\quad{E_{C}/e}} + {E_{f\quad 0}/e} - {\frac{e}{ɛ}{\int_{0}^{d}{{\mathbb{d}x}{\int_{0}^{x}{\left( {{N_{si}(x)} - {N_{F}(x)}} \right){\mathbb{d}x}}}}}} - {e\quad{{dN}_{st}^{\prime}/ɛ}} - {e\quad{N_{b}/{C_{b}.}}}}} & (2) \end{matrix}$ The positive-charge distribution profile N_(si)(x) is replaced by the net charge distribution N_(si)(x)−N_(F)(x), where N_(F)(x) is the concentration of the negatively charged fluorine ion. The surface-trap density (N_(st)) could be modified by the plasma treatment.

By applying Poisson's equation and Fermi-Dirac statistics, a simulation was made of the conduction-band profiles and the electron distributions of AlGaN/GaN HEMT structures with and without fluorine ions incorporated in AlGaN layer. Both structures have the same epitaxial structure, shown in FIG. 7. For the fluorine ions incorporated HEMT structure, the negatively charged fluorine ions' profile was extracted from SIMS measurement results of the fluorine atoms' distribution of an AlGaN/GaN HEMT structure that was treated by CF₄ plasma at 150 W for 150 s and converted to an E-mode HEMT. The simulated conduction band diagrams at zero gate bias were plotted in FIGS. 22 and 23 For the simulated conduction band of E-mode HEMT, as shown in FIG. 22 the fluorine concentration is approximated by using a linear distribution that the peak fluorine concentration is 3×10¹⁹ cm⁻³ at the AlGaN surface, and the fluorine concentration is assumed to be negligible at the AlGaN/GaN interface. A total fluorine ion sheet concentration of about 3×10¹³ cm⁻² is sufficient to not only compensate the silicon doping (about 3.7×10¹³ cm⁻²) in the AlGaN barrier but also to compensate for the piezoelectric and spontaneous polarization-induced charges (about 1×10¹³ cm⁻²). Two significant features can be observed. First, compared to the untreated AlGaN/GaN HEMT structure, the plasma-treated structure has its 2DEG channel's conduction-band minimum above Fermi level, indicating a completely depleted channel and E-mode HEMT. As shown in the electron profiles in FIG. 24, there are no electrons in the channel under the zero gate bias in the plasma-treated structure, indicating an E-mode HEMT operation. Second, the immobile negatively charged fluorine ions cause an upward bending of the conduction band, especially in AlGaN barrier, yielding an additional barrier height ΦF, as shown in FIG. 23 Such an enhanced barrier can significantly suppress the gate Schottky diode current of AlGaN/GaN HEMT in both the reverse and forward bias region.

The epitaxial structure for the monolithically-integrated E/D-mode HFET consists of: (a) a semiconductor substrate (sapphire, SiC, silicon, AlN or GaN, etc.); (b) a buffer layer grown on the substrate; (c) a channel layer ; (d) a barrier layer including an undoped spacer layer, a modulation doped carrier supply layer and an undoped cap layer. The fabrication process includes: (f) active region isolation; (g) ohmic contacts formation on source and drain terminals; (h) photolithography of the gate regions for the E-mode HFETs; (i) fluoride-based plasma treatment to the exposed barrier layer of the E-mode HFETs; (j) gate metal deposition of the E-mode HFETs; (k) photolithography of the gate regions for the D-mode HFETs; (l) gate metal deposition of the D-mode HFETs; ml) surface passivation of the D-mode and E-mode HFETs; (n) gate annealing at elevated temperatures. A schematic process flow for this monolithic integration is depicted in FIG. 25.

The active device isolation in the above-described monolithic integration process uses the mesa etching, which features the active region removal by etching techniques in the areas without the HFETs. Such an approach imposes limits to the integration density, photolithography resolution . For high frequency circuits, the edges of the mesas also introduce additional discontinuities for wave propagation, which in turn, complicate the circuit design and analysis. Since the fluoride-based plasma treatment is able to deplete the electrons in the channel (providing electrical turn-off of the channel), it can be used for device isolation. With increased plasma power and treatment time, the regions where active devices are not desired can be completely turned off electrically, providing electrical isolation between devices. Such an approach does not involve any material removal, therefore, enables a flat wafer surface for planar process.

EXAMPLE

FIGS. 26A through 26F illustrate the process of monolithically integrating the E/D-mode HFETs for integrated circuits according to one embodiment of the present invention. FIG. 26A illustrates a preferred epitaxial structure of this invention, where the reference numerals 110, 120, 130 and 140 denote substrate, low temperature grown GaN nucleation layer, high temperature grown GaN buffer layer, and Al_(x)G a_(1-x)N barrier layer including the modulation doped carrier supply layer. The manufacturing method of monolithic integration of E/D-mode HFETs for integrated circuits is described below. For both D-mode and E-mode HFETs, the mesa isolations are simultaneously formed, using Cl2/He plasma dry etching followed by the source/drain ohmic contact formation 160 with Ti, Al, Ni and Au annealed at 850° C. for 45 seconds as shown in FIG. 26B. The gates as well as gate-source interconnections of D-mode HFETs are patterned by photoresist 170 as shown in FIG. 26C, followed by depositing and lift-off Ni and Au 178. Thereafter, the E-mode HFETs' gates, pads and second interconnections are patterned with photoresist 175 as shown in FIG. 26D. Then the fluoride ions are incorporated into Al_(x)Ga_(1-x)N barrier layer beneath E-mode HFETs' gates by, for examples, either fluoride plasma treatment or fluoride ions implantation as shown in FIG. 26D. The gate electrode 180 is formed on the barrier layer 140 by depositing and lift-off Ni and Au. Thereafter, post-gate rapid thermal annealing (RTA) is conducted at 400-450° C. for 10 minutes. A passivation layer 190 is grown on the top of the wafer as shown in FIG. 26E. Then the contact pads and via holes are opened by removing portions of the passivation layer on them as shown in FIG. 26F. Finally, a third interconnection is formed.

An E/D HFETs inverter and a 17-stage direct-coupled ring oscillator were created on a 20 nm Al_(0.25)Ga_(0.75)N barrier layer on 2 μm GaN buffer layer with typical CF₄ plasma treatment condition of 150 W for 150 seconds and typical post-gate RTA condition of 450° C. for 10 minutes for E-mode HFETs. The inverter has a NM_(L) of 0.21 V and a NM_(H) of 0.51V at a supply voltage of 1.5 V. When supply voltage of 3.5 V is applied, the 17-stage ring oscillator shows a maximum oscillation frequency of 225 MHz corresponding to a minimum propagation delay of 130 ps.

EXAMPLE

This embodiment describes a method for planar monolithic integration of E-mode and D-mode AlGaN/GaN HFETs. As described in the first embodiment, the isolation among active devices can be obtained by creating active device mesa through etching, which creates a non-flat wafer surfaces. In integrated circuit fabrications, planar process are always desirable. Following the same principle of channel depletion by the negatively charged fluorine ions in the AlGaN, depletion of the desired inactive (isolated) areas by fluoride-based plasma treatment can be effected. The plasma power and treatment time can both be increased to enhance the carrier depletion. The process flow is illustrated in FIG. 27, where: (a) source/drain ohmic contacts formation; (b) D-mode HFET gate definition by photolithography; (c) D-mode HFET gate metallization and part of the interconnects formation; (d) E-mode HFET gate definition by photolithography followed by plasma treatment; (e) E-mode HFET gate metallization and part of the interconnects formation; (f) isolation region definition by photolithography followed by the second fluoride-based plasma treatment; (g) final chip followed by passivation.

EXAMPLE

The AlGaN/GaN HEMT structure in this example was grown on a (0001) sapphire substrates in an Aixtron AIX 2000 HT MOCVD system. The HEMT structure consists of a low-temperature GaN nucleation layer, a 2.5-μm thick unintentionally doped GaN buffer layer, and an AlGaN barrier layer with a nominal 30% Al composition. The barrier layer is composed of a 3-nm undoped spacer, a 21-nm carrier supplied layer doped at 2×1018 cm⁻³, and a 2-nm undoped cap layer. Room-temperature hall measurements of the structure yield an electron sheet density of 1.3×1013 cm⁻² and an electron mobility of 950 cm²/Vs.

The integration process flow is illustrated in FIG. 28. First, the source/drain ohmic contacts of the E/D-mode devices were formed simultaneously by a deposition of e-beam evaporated Ti/Al/Ni/Au (20 nm/150 nm/50 nm/80 nm) and rapid thermal annealing at 850° C. for 30 seconds, as shown in FIG. 28(a). Second, the active regions for both E/D-mode devices were patterned by a photolithography, which is followed by the CF₄ plasma treatment in a reactive ion etching system. The plasma power was 300 W, and the treatment time was 100 seconds. The gas flow was controlled to be 150 sccm, and the plasma bias was set to be 0 V. The isolation regions are the locations where a large amount of fluorine ions are incorporated in the AlGaN and GaN layers near the surface, and then deplete the two-dimensional electron gas in the channel, as shown in FIG. 28(b). The D-mode HEMTs' gate electrodes were then patterned by the contact photolithography, which is followed by the e-beam evaporation of Ni/Au (50 nm/300 nm) and liftoff as shown in FIG. 28(c). Next, E-mode HEMTs' gate electrodes and interconnections were defined. Prior to the e-beam evaporation of Ni/Au, the gate regions of the E-mode HEMTs were treated by the CF₄ plasma (which has a negligible etching to AlGaN) at 170 W for 150 seconds, as shown in FIG. 28(d). This plasma treatment performed the function of converting the treated devices from the D-mode to E-mode HEMT. A 200-nm-thick silicon nitride passivation layer was deposited by PECVD, and the probing pads were opened. Then, the sample was annealed at 400° C. for 10 minutes to repair the plasma-induced damage in the AlGaN barrier and channel of the E-mode HEMTs as in FIG. 28(e). As a comparison, the D-mode devices were fabricated on another piece of the sample from the same substrate by the standard process, in which inductively coupled plasma reactive ion etching was used to define the mesa as the active region. For the direct-coupled FET logic inverter shown in FIG. 1A, the E-mode HEMT driver is designed with a gate length, gate-source spacing, gate-drain spacing, and gate width of 1.5, 1.5, 1.5, and 50 μm, respectively; the D-mode HEMT load is designed with a gate length, gate-source spacing, gate-drain spacing, and gate width of 4, 3, 3, and 8 μm, yielding a ratio β=(W_(E)/L_(E))/(W_(D)/L_(D)) of 16.7. Discrete E-mode and D-mode HEMTs with 1.5×100 μm gate dimension are fabricated for characterizations.

Device and Circuit Characteristics

For the E/D-mode HEMTs fabricated by the planar process, the output characteristics are plotted in FIG. 29. The peak current density for D-mode and E-mode HEMTs are about 730 and 190 mA/mm. FIG. 30 shows the DC transfer characteristics comparison between the planar and the standard process. It can be seen that the drain leakage current for the planar process is about 0.3 mA/mm, reaching the same level as the devices fabricated by the standard mesa etching. The D-mode HEMTs by the planar process have the comparable drain-current and transconductance characteristics as shown in FIG. 30(b), as the ones by the standard process. Also, the leakage current between two pads (400×100 μm²) was measured with a spacing of 150 μm. At the DC bias of 10 V, the leakage current by the planar process is about 38 μA, at the same level of the standard mesa etching sample (about 30 μA). Compared with the standard mesa process, the fluoride-based plasma treatment can achieve the same level of the active device isolation, enabling a complete planar-integration process. The E-mode HEMTs exhibit a smaller transconductance (“g_(m)”) compared to the D-mode devices, which is due to the incomplete recovery of the plasma-induced damage. The fact that the sample has been through a thermal annealing at 400° C. also indicates that a good thermal stability is expected at a temperature at least up to 400° C. It should be noted that an ion-implantation technique has also been developed for inter-device isolation accomplished by a multiple energy N+ implantation to produce significant lattice damage throughout the thickness of the GaN buffer layer. Compared to the ion-implantation technique, the CF₄ plasma-treatment technique has the advantages of low cost and low damage.

The E/D-mode HEMTs DCFL inverter fabricated by the planar-integration process was characterized. FIG. 31 shows the measured static voltage transfer curve of the inverter at a supply voltage V_(DD)=3.3 V. High- and low-output logic levels (V_(OH) and V_(OL)) are 3.3 and 0.45 V, respectively, with the output swing (V_(OH)-V_(OL)) of 2.85 V. The DC voltage gain in the linear region is 2.9. By defining the values of V_(IL) and V_(IH) at the unit gain points, the low and high noise margins are 0.34 and 1.47 V. The inverter DC circuit is also shown in FIG. 31. The leakage current with the E-mode device pinch-off is about 3 μA, which is consistent with the discrete device results.

EXAMPLE

FIG. 32 shows AlGaN/GaN epitaxial heterostructures during the fabrication of an HEMTs according to the present innovations. They include the following: 2.5 μm GaN buffer layer and channel, 2 nm undoped Al_(0.25)Ga0_(.75)N spacer, 15 nm Al_(0.25)Ga_(0.75)N carrier supply layer with Si doping at 1×1018 cm⁻³, and a 3 nm undoped Al_(0.25)Ga_(0.75)N cap layer. The structures were grown on sapphire substrate in an Aixtron 2000 HT MOCVD system. The process flow is shown in FIGS. 33(a) through 33(f).

The mesa and source/drain ohmic contacts were formed simultaneously for both E-mode and D-mode HEMTs, as shown in FIG. 33(a) and (b). The D-mode HEMTs' gate electrodes were then formed by photolithography, metal deposition, and liftoff, as shown in FIGS. 33(c) and (d). After defining the patterns of E-mode HEMTs' gates and interconnections, samples were treated by CF₄ plasma at a source power of 150 W for 150 seconds in an STS RIE system as shown in FIG. 33(e), followed by gate metallization and lift-off for the E-mode HEMTs. Inspected by atomic force microscope (“AFM”) measurements, the AlGaN barrier thickness was reduced by 0.8 nm after the plasma treatment. Next, a post-gate thermal annealing was conducted at 450° C. for 10 minutes as shown in FIG. 33(f). The CF₄ plasma treatment converts the treated GaN HEMT from D-mode to E-mode. The magnitude of threshold voltage shift depends on the treatment conditions, e.g., plasma power and treatment time, as described previously. The post-gate annealing is employed to recover the plasma-induced damages in AlGaN barrier and channel. In principle, the higher is the annealing temperature, the more efficient is the damage repair. However, in practice, the post-gate annealing temperature should not exceed the highest temperature (˜500° C., in our case) that the gate Schottky contact can endure, as mentioned earlier. It was found that the D-mode HEMTs' characteristics remain the same after the annealing , whereas the E-mode HEMTs' drain current density increases significantly. The post-gate annealing was found to have no effect on the threshold voltage shift introduced by the plasma treatment.

For the E/D inverter and the ring oscillator, the most important physical design parameter is the drive/load ratio, β=(W_(g)/L_(g))E-mode/(W_(g)/L_(g))D-mode. Several E/D inverters and ring oscillators with β varying from 6.7 to 50 were designed and fabricated on the same sample. The geometric parameters of each design are listed in FIG. 34. Discrete E-mode and D-mode GaN HEMTs with 1×100 μm gate dimension were simultaneously fabricated on the same sample for dc and RF testing.

Characteristics of E/D-mode HEMTs

DC current-voltage (I-V) characteristics of the discrete devices were measured using an HP4156A parameter analyzer. The transfer characteristics of the E/D-mode HEMTs are plotted in FIG. 35(a). On-wafer small-signal RF characterization of the discrete devices were carried out in the frequency range of 0.1-39.1 GHz using Cascade microwave probes and an Agilent 8722ES network analyzer. The measured parameters of E/D-mode HEMTs are listed in FIG. 36. The threshold voltage and peak transconductance (g_(m,max)) are 0.75 V and 132 mS/mm for the E-mode HEMT and −2.6 V and 142 mS/mm for the D-mode HEMT. The relatively low peak current density of 480 mA/mm for D-mode HEMT is due to relatively low Al composition of 25% and relatively low doping density of 1×1018 cm⁻³ in AlGaN barrier layer. Different from the AlGaN/GaN HEMTs used for RF/microwave power amplifiers, the digital ICs are less demanding on the current density. As shown in FIG. 35(b), a low knee voltage of 2.5 V is obtained for E-mode HEMTs. At a gate bias of 2.5 V, an on-resistance of 7.1 Ω·mm was achieved for the E-mode HEMT, which is the same as that for the D-mode HEMT at the same saturation current level. One observation is that the gate current in both the reverse- and forward-bias conditions is significantly reduced in the E-mode HEMT as shown in FIG. 37(a) compared to the D-mode HEMT. The mechanism of this gate current suppression is the modulation of the potential in the AlGaN barrier by the negatively charged fluorine ions that are introduced by the plasma treatment. The conduction-edge band diagrams simulated for both D- and E-mode HEMTs by solving Poisson's equation and Fermi-Dirac statistics. For the simulated conduction band of E-mode HEMTs, the profile of fluorine distribution is approximated by a linear function that features a maximum fluorine ion concentration of 3×1019 cm⁻³ at the AlGaN surface and reaches zero (negligible) at the AlGaN/GaN interface. A total fluorine ion sheet concentration of about 3×1013 cm⁻² is sufficient to compensate no only the Si+ donors' concentration of about 3.7×1012 cm⁻² but also the piezoelectric and spontaneous polarization-induced charges (about 1×1013 cm⁻²). It should be noted that the Schottky barrier height at the gate/AlGaN junction is assumed to remain the same in this example. As seen from the simulated conduction bands shown in FIG. 37(b) and (c), the potential of the AlGaN barrier can be significantly enhanced by the incorporation of the fluorine ions, resulting in enhanced Schottky barrier and the subsequent gate current suppression. The gate current suppression in the forward bias is particularly beneficial to digital IC applications. The suppressed gate current allows the E-mode devices' gate bias to be increased up to 2.5 V. Such an increase results in a larger gate voltage swing, larger dynamic range for the input, and higher fan-out. The increased input voltage swing permits higher supply voltage that is an important factor in achieving higher operation speed and higher noise margins for digital ICs. Without the increased gate input swing, a larger supply voltage will lead to an output voltage (at logic “high”) that exceeds the turn-on voltage of the following stage's input gate. The wider dynamic range for the input enables direct logic level matching between the input and the output, eliminating the need for level adjustment between adjacent stages.

It should be noted that silicon nitride passivation, which is important technique generally used for the stable operation of the GaN-based HEMTs, can also affect the threshold voltage to a lesser degree. The deposition of silicon nitride passivation layer on the active region, in general, can alter the stress in the AlGaN and GaN layers. Subsequently, the piezoelectric polarization charge density and the threshold voltage of the device can be slightly modified. In general, the widely used silicon nitride layer deposited by high-frequency PECVD introduces additional tensile stress in the AlGaN layer, resulting in a negative shift of the threshold voltage in the range of a few tenths of a volt. In practice, this effect should be taken into consideration in the process design. The plasma treatment dose can be increased accordingly to compensate the negative shift in threshold voltage by the SiN passivation layer. The stress of the SiN passivation layer can also be reduced by modifying the process parameters of the PECVD deposition so that the negative shift in the threshold voltage is minimized.

EXAMPLE DCFL Inverter

The circuit schematic of an E/D HEMT inverter is shown in FIG. 1(a), where the D-mode HEMT is used as load with its gate tied to its source and the E-mode HEMT is used as a driver. FIG. 1B shows a fabricated photomicrograph of an inverter according to the present innovations. The fabricated inverters were characterized using an HP4156A parameter analyzer. FIG. 38 shows the static voltage transfer characteristics (the solid curve) for a typical E/D HEMT inverter. The rise in the output voltage at the large input voltages (>2.1 V) is a result of the gate Schottky diode's turn-on. The dashed curve is the same transfer curve with the axis interchanged and represents the input-output characteristics of the next inverter stage. The parameter definitions follow those given for GaAs- and InP-based HEMTs. The static output levels (V_(OH) and V_(OL)) are given by the two intersections of the curves in stable equilibrium points, and the difference between the two levels is defined as the output logic voltage swing. The inverter threshold voltage (V_(TH)) is defined as V_(in), where V_(in) is equal to V_(out). The static noise margins are measured using the method of largest width for both logic-low noise margin (NM_(L)) and logic-high noise margin (NM_(H)). The measured static voltage transfer curves of E/D inverters with β varied from 6.7 to 50 at a supply voltage V_(DD)=1.5 V are plotted in FIG. 39. High output logic level (V_(OH)) is maintained at 1.5 V, indicating that the E-mode HEMTs are well switched off, whereas low output logic level (V_(OL)) is improved from 0.34 to 0.09 V as a result of β increasing from 6.7 to 50. As a result, the output logic swing defined as V_(OH)-V_(OL) increases from 1.16 to 1.41 V. As β is increased from 6.7 to 50, V_(TH) decreases from 0.88 to 0.61 V, the DC voltage gain (G) in the linear region increases from 2 to 4.1. FIG. 40 lists the measured values of static noise margins, as well as V_(OH), V_(OL), output logic swing, V_(TH), and G. Both NM_(L) and NM_(H) are improved as β increases.

The static voltage transfer curves of the inverter with β=10 were measured at different supply voltages and are plotted in FIG. 41. The circuit performance parameters are listed in FIG. 42. When supply voltage increases, all the parameters of E/D inverter increase accordingly. This means that the increase of supply voltage improves the static performance of the E/D invert. As well known, for HEMT and MESFET E/D inverters, the input voltage is always limited by the turn-on voltage of the gate Schottky diode. At a large input voltage, gate conduction causes an increased voltage drop across the parasitic source resistance of the E-mode device that is used as a driver, raising the voltage of the logic low level. The rise in the output voltage can be observed in the static transfer curves as the supply voltage and the required input voltage increase, as shown in FIG. 41. The gate current, when increased by the large input voltage, can significantly degrade the inverter's capability of driving multiple stages, reducing the fan-out. Usually, the turn-on voltage of the gate Schottky diode is around 1 V for a normal AlGaN/GaN HEMT. For a gate-recessed E-mode GaN HEMT, the thinned AlGaN barrier further decreases the turn-on voltage due to an enhanced tunneling current. As a result, for the inverter based on a gate-recessed E-mode GaN HEMT, the output voltage rises when the input voltage is beyond 0.8 V. As disclosed earlier, the E-mode GaN HEMT fabricated by CF₄ plasma treatment possesses a suppressed gate current because of the enhanced Schottky barrier in the AlGaN layer, which is induced by the electronegative fluorine ions. Such a gate current suppression enables a larger input voltage swing for the E/D inverter. As can be seen in FIG. 41, the rise in output voltage does not occur until the input voltage is beyond 2 V, indicating about 1 V extension of input voltage swing. FIG. 43 shows the dependences of the load current and input current on the input voltage. The lower input current (gate current of the E-mode HEMT) implies a larger amount of fan-out. At “ON” state, the input current exceeds 10% load current when the input voltage is larger than 2 V.

EXAMPLE DCFL Ring Oscillator

FIG. 1B shows a schematic circuit diagram of a DCFL ring oscillator, which is formed with an odd-numbered E/D inverter chain. Seventeen-stage ring oscillators were fabricated with inverters' β=6.7, 10, and 25. For each ring oscillator, 36 transistors were used including an output buffer. FIG 1D shows a photomicrograph of a fabricated ring oscillator according to the present innovations. The ring oscillator were characterized on-wafer using an Agilent E4404B spectrum analyzer and an HP 54522A oscilloscope. The DC power consumption was also measured during the ring oscillators' operation. FIGS. 44 and 45 show the frequency- and time-domain characteristics of the 17-stage ring oscillator with β=10 biased at V_(DD)=3.5 V. The fundamental oscillation frequency is 225 MHz. According to the formula of propagation delay per stage τpd=(2nƒ)⁻¹, where the number of stages n is 17, and τ_(pd) was calculated to be 130 ps/stage. The dependences of τ_(pd) and power-delay product on V_(DD) were plotted in FIG. 46. With the increase of supply voltage, the propagation delay was reduced, whereas power-delay product increases. Compared to τ_(pd) (234 ps/stage) measured at 1 V, τ_(pd) measured at 3.5 V is reduced by 45%. The fact that the ring oscillator can operate at such a high V_(DD) attributes to the larger input voltage swing realized by the CF₄ plasma treatment technique used in the integration process. A minimum power-delay product of 0.113 pJ/stage was found at a V_(DD) of 1 V. FIG. 46 also shows τ_(pd) and power-delay product characteristics of ring oscillators with β=6.7 and 25. For the ring oscillator with β=6.7, the largest τ_(pd) and power-delay product is due to the larger input capacitance determined by the larger gate length (1.5 μm) of the E-mode HEMT. For the ring oscillator with β=25, the larger τ_(pd) is due to the lower charging current determined by the larger gate length (4 μm) of the D-mode HEMT, whereas the power-delay product is at the same level as the one with β=10. When this integration technology is implemented in the sub-micrometer regime, the gate delay time is expected to be further reduced.

Recently, the discrete E-mode HEMTs and the DCFL ring oscillators have been tested at elevated temperature up to 375 C. No significant shift has been observed in the threshold voltage of the E-mode HEMTs, and the ring oscillator exhibits an oscillation frequency of 70 MHz at 375 C.

According to a disclosed class of innovative embodiments, there is provided: a method for fabricating a semiconductor active device, comprising the actions of: a) patterning a vertically inhomogeneous III-N semiconductor layer to expose channel areas of first transistors but not channel areas of second transistors; b) introducing fluorine into said channel areas of said first transistors, but substantially not into said channel areas of said second transistors, to provide different threshold voltage values for said first and second transistors; and c) forming sources, drains, and gates, to complete formation of said transistors; wherein said action (b) causes said first transistors, but not said second transistors, to have a positive threshold voltage.

According to a disclosed class of innovative embodiments, there is provided: A method for fabricating a III-N semiconductor active device, comprising the actions of: forming a first gate electrode pattern, over desired depletion-mode transistor channel locations, in a vertically inhomogeneous semiconductor layer having the general composition of (Al_(x)M_((1-x)))Y, where M is predominantly Ga and Y is predominantly N, and the Al fraction is higher near a surface of said layer; introducing fluorine and forming a second gate electrode pattern, over desired enhancement-mode transistor channel locations, in a self-aligned combination of actions; and forming sources, drains, and interconnections to complete formation of an electrical circuit.

According to a disclosed class of innovative embodiments, there is provided: an integrated circuit, comprising: enhancement-mode and depletion-mode transistors, mutually interconnected to form an electrical circuit; wherein said transistors all have channels formed in a common layer of vertically inhomogeneous Group III nitride semiconductor material having a higher Al fraction near a surface of said layer; and wherein said enhancement-mode transistors have a fluorine concentration, in at least one level of said layer, which is more than one thousand times the fluorine concentration in a corresponding portion of said layer at said depletion-mode transistors.

Modifications and Variations

As will be recognized by those skilled in the art, the innovative concepts described in the present application can be modified and varied over a tremendous range of applications, and accordingly the scope of patented subject matter is not limited by any of the specific exemplary teachings given.

While the above example describes a lateral device, it is also contemplated that the various disclosed inventions can be used in merged devices including a lateral transistor element.

It is also contemplated that the disclosed inventions can be applied to some classes of vertical devices with appropriate changes.

The disclosed technology can also be used to create a merged device, in which enhancement and depletion transistors are combined inside a single isolation area.

For another example, minor variations in the semiconductor composition, e.g. use of a phosphonitride instead of a pure nitride, or use of an Al_(x)Ga_((1-x))N over Al_(y)Ga_((1-y))N heterostructure for the basic HEMT structure, are contemplated as alternatives.

The present innovations provide users with the capability of making single voltage supply RFIC and MMIC. It also provides users a monolithic integration technology for implementing GaN-based digital integrated circuits that are needed for high temperature electronics.

For another example, in the various device structures shown, a variety of materials can optionally be used for gate electrodes (taking into account any resulting differences in work function).

In one contemplated class of embodiments, gate materials with different work functions can be used in combination with the trapped sheet charge layer provided by various embodiments described above, to increase the difference between the threshold voltages of the two types of transistors (for a given fluorine dosage). Alternatively, this can be used to achieve four different threshold voltages on a single III-N chip, if desired.

Similarly, various changes or substitutions can be made in the epitaxial layer doping.

Similarly, as noted above, various materials can optionally be used for the substrate.

The methods and structures described above are not only applicable to HEMT or MISHFET devices, but also to III-N MESFET (Metal-semiconductor FET) and MOSFET devices. (MESFET devices do not use a gate insulator, but instead provide a Schottky barrier between gate and channel.)

Additional general background, which helps to show variations and implementations, may be found in the following publications, all of which are hereby incorporated by reference:

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None of the description in the present application should be read as implying that any particular element, step, or function is an essential element which must be included in the claim scope: THE SCOPE OF PATENTED SUBJECT MATTER IS DEFINED ONLY BY THE ALLOWED CLAIMS. Moreover, none of these claims are intended to invoke paragraph six of 35 USC section 112 unless the exact words “means for” are followed by a participle.

The claims as filed are intended to be as comprehensive as possible, and NO subject matter is intentionally relinquished, dedicated, or abandoned. 

1. A method for fabricating a semiconductor active device, comprising the actions of: a) patterning a vertically inhomogeneous III-N semiconductor layer to expose channel areas of first transistors but not channel areas of second transistors; b) introducing fluorine into said channel areas of said first transistors, but substantially not into said channel areas of said second transistors, to provide different threshold voltage values for said first and second transistors; and c) forming sources, drains, and gates, to complete formation of said transistors; wherein said action (b) causes said first transistors, but not said second transistors, to have a positive threshold voltage.
 2. The method of claim 1, wherein said semiconductor layer is an AlGaN/GaN layered structure.
 3. The method of claim 1, wherein said step (b) also introduces fluorine into device isolation zones.
 4. The method of claim 1, wherein said action of introducing fluorine into said channel areas of said first transistors is self-aligned to the locations of said gates.
 5. The method of claim 1, wherein said semiconductor layer is an epitaxial layer supported by a substrate of sapphire, silicon, SiC, AlN, or GaN.
 6. The method of claim 1, wherein said semiconductor layer is an epitaxial structure comprising a nucleation layer of GaN or AlN, a buffer layer of GaN or AlGaN, a GaN channel, and an AlGaN barrier.
 7. The method of claim 1, wherein said sources and said drains for said transistors are formed by depositing multiple metal layers and rapid thermal annealing, wherein said metals are selected from the group consisting of Ti, Al, Ni, and Au.
 8. The method of claim 1, wherein said channel areas are subjected to fluorine-based plasma treatment using a feed gas selected from the group consisting of CF₄, SF₆, BF₃, and mixtures thereof.
 9. The method of claim 1, wherein a gate electrode will be formed by depositing gate metal followed by lift-off or metal etching, using at least one metal selected from the group consisting of Ti, Al, Ni, and Au.
 10. The method of claim 1, further comprising the subsequent step of depositing, over said transistors, a passivation material selected from the group consisting of silicon nitride, silicon oxide, polyimide, and benzocyclobutene.
 11. The method of claim 1, wherein both said first and said second transistors are subjected to a final thermal annealing at approximately the highest temperature which will not change the Schottky barrier below the gate.
 12. The method of claim 1, wherein an additional thin film of dielectric material is inserted between said gates and the surface of the III-N semiconductor.
 13. The method of claim 1, wherein said gates are placed directly on said semiconductor layer, without any recess etch.
 14. The method of claim 1, wherein said gates are placed on a dielectric which lies on a planar portion of said semiconductor layer.
 15. The method of claim 1, wherein an additional thin film of dielectric material is inserted between said gates and the surface of the III-N semiconductor.
 16. A method for fabricating a III-N semiconductor active device, comprising the actions of: forming a first gate electrode pattern, over desired depletion-mode transistor channel locations, in a vertically inhomogeneous semiconductor layer having the general composition of (Al_(x)M_((1-x)))Y, where M is predominantly Ga and Y is predominantly N, and the Al fraction is higher near a surface of said layer; introducing fluorine and forming a second gate electrode pattern, over desired enhancement-mode transistor channel locations, in a self-aligned combination of actions; and forming sources, drains, and interconnections to complete formation of an electrical circuit.
 17. The method of claim 16, wherein said semiconductor layer is an epitaxial layer supported by a substrate of sapphire, silicon, SiC, AlN, or GaN.
 18. The method of claim 16, wherein said semiconductor layer is an epitaxial structure comprising a nucleation layer of GaN or AlN, a buffer layer of GaN or AlGaN, a GaN channel, and an AlGaN barrier.
 19. The method of claim 16, wherein said sources and said drains are formed by depositing multiple metal layers and rapid thermal annealing, wherein said metals are selected from the group consisting of Ti, Al, Ni, and Au.
 20. The method of claim 16, wherein said desired enhancement-mode transistor channel locations are subjected to fluorine-based plasma treatment using a feed gas selected from the group consisting of CF₄, SF₆, BF₃, and mixtures thereof.
 21. The method of claim 16, wherein a gate electrode is formed by depositing gate metal followed by lift-off or metal etching, using at least one metal selected from the group consisting of Ti, Al, Ni, and Au.
 22. The method of claim 16, further comprising the subsequent step of depositing, a passivation material selected from the group consisting of silicon nitride, silicon oxide, polyimide, and benzocyclobutene.
 23. An integrated circuit, comprising: enhancement-mode and depletion-mode transistors, mutually interconnected to form an electrical circuit; wherein said transistors all have channels formed in a common layer of vertically inhomogeneous Group III nitride semiconductor material having a higher Al fraction near a surface of said layer; and wherein said enhancement-mode transistors have a fluorine concentration, in at least one level of said layer, which is more than one thousand times the fluorine concentration in a corresponding portion of said layer at said depletion-mode transistors.
 24. The circuit of claim 23, wherein said semiconductor material is an epitaxial layer supported by a substrate of sapphire, silicon, SiC, AlN, or GaN.
 25. The circuit of claim 23, wherein said semiconductor material is an epitaxial structure comprising a nucleation layer of GaN or AlN, a buffer layer of GaN or AlGaN, a GaN channel, and an AlGaN barrier.
 26. The circuit of claim 23, further comprising the subsequent step of depositing, a passivation material selected from the group consisting of silicon nitride, silicon oxide, polyimide, and benzocyclobutene. 